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Request for meeting

Majandus- ja Kommunikatsiooniministeerium · 1. oktoober 2026
Seotud ettevõtted
Brandner Electronics OÜ (adressaat)
Viit
6-4/3403-1
Registreeritud
1. oktoober 2026
Dokumendi liik
Sissetulev kiri
Adressaat
Brandner Electronics OÜ
Saabumis/saatmisviis
e-post
Funktsioon
6 Rahvusvahelise koostöö korraldamine
Sari
6-4 Tervitus- ja tutvustuskirjad, kutsed üritustel osalemiseks
Toimik
6-4/2026
Vastutaja
Anu Vask (Majandus- ja Kommunikatsiooniministeerium, Kantsleri valdkond, Kommunikatsiooni ja rahvusvahelise koostöö osakond)
Lahendamise tähtaeg
31. oktoober 2026

Failid

  • 📎Brandner_Electronics_Ambassador_Visit_Press_Release_26_September_2026.pdf2133 KB
  • 📎E-kiri.eml2338 KB

Sisu (failidest)

BRANDNER ELECTRONICS OÜ PRESS RELEASE | 26 SEPTEMBER 2026 FOR IMMEDIATE RELEASE Ambassador of India to Estonia Visits Brandner Electronics OÜ in Paide Visit highlights growing India-Estonia cooperation in advanced electronics manufacturing H.E. Mr Ashish Kumar Sinha, Ambassador of India to the Republic of Estonia, with Dr Eswara Rao Nandam during the Ambassador's visit to Brandner Electronics OÜ in Paide on 25 September 2026. Paide, Estonia - 26 September 2026. Brandner Electronics OÜ was honoured to receive H.E. Mr Ashish Kumar Sinha, Ambassador of India to the Republic of Estonia, at its printed circuit board manufacturing facility in Paide on Friday, 25 September 2026. Arranged through the Commerce Wing of the Embassy of India in Tallinn, the visit gave the Ambassador a first-hand view of Brandner's manufacturing operations and its capabilities in standard, multilayer, high-density interconnect and aluminium printed circuit boards. The Ambassador was received by Dr Eswara Rao Nandam, Group Chairman of Polymatech, together with Mr Vishaal Nandam, Managing Board Member of Brandner Electronics OÜ. The facility tour was conducted by Ms Tarja Rapala-Virtanen, Chief Executive Officer, Mr Urmas Aruoja, Managing Director, and members of Brandner's production team. 25 SEPTEMBER 2026 INDIAN-BACKED 2027 Ambassador's visit to Paide Advanced manufacturing in Estonia Next phase of capability expansion Brandner Electronics OÜ | Tööstuse 17, 72720 Paide, Estonia | www.brandner.ee Page 1 BRANDNER ELECTRONICS OÜ PRESS RELEASE | 26 SEPTEMBER 2026 Manufacturing capability and the next phase H.E. Mr Ashish Kumar Sinha examines a PCB production panel during his tour of the Paide facility, accompanied by Dr Eswara Rao Nandam and members of the Brandner team. During the visit, Brandner presented its current operations and phased development plan for Estonia to His Excellency the Ambassador. Brandner has commenced PCB production for Polymatech's vein finders and is developing PCBs for NANORAA smartphones. Following successful prototype validation, manufacturing capacity and process capabilities will be expanded for volume production. The near-term programme includes further PCB capability additions, surface-mount technology module assembly and preparations for silicon carbide semiconductor packaging and power modules for electric-vehicle applications from calendar year 2027. The group is also evaluating sapphire crystal growth and processing as part of the longer-term development of the Paide site. The Polymatech group's investment in Brandner Electronics OÜ has LONG-TERM COMMITMENT been made through AEIM Pte. Ltd., Singapore. It has supported the Commitment acquisition and operational development of the Paide facility, preserved advanced European manufacturing capability and to Estonia established a platform for continued expansion in Estonia. "We are deeply honoured by His Excellency's visit to our Paide facility. Estonia offers a skilled workforce, a transparent business environment and a strong foundation for advanced manufacturing. The visit has encouraged our entire team as we build the next phase of Brandner in Estonia." - Dr Eswara Rao Nandam, Group Chairman, Polymatech "It was enriching to visit the Brandner Electronics facility in Paide; a strategic manufacturing base marks an important milestone in growing bilateral commercial ties between India and Estonia, looking forward to its exponential growth in near future." - H.E. Mr Ashish Kumar Sinha, Ambassador of India to the Republic of Estonia Brandner Electronics OÜ | Tööstuse 17, 72720 Paide, Estonia | www.brandner.ee Page 2 BRANDNER ELECTRONICS OÜ PRESS RELEASE | 26 SEPTEMBER 2026 A commemorative moment H.E. Mr Ashish Kumar Sinha plants a commemorative tree during his visit to Brandner Electronics OÜ in Paide, accompanied by Dr Eswara Rao Nandam and members of the Brandner team. The visit concluded with discussions on strengthening commercial and industrial links between India and Estonia. Brandner intends to combine Estonia's engineering and manufacturing strengths with the Polymatech group's international product platforms and access to the Indian market. About Brandner Electronics OÜ Brandner Electronics OÜ (registry code 17117350) is a printed circuit board manufacturer based in Paide, Järva County, Estonia. The company manufactures standard, multilayer, high-density interconnect and aluminium PCBs. Brandner has commenced production of PCBs for Polymatech's Vein Finders and is developing mobile-phone PCBs, while adding further capabilities in module assembly and advanced electronics manufacturing. Visit www.brandner.ee. About AEIM Pte. Ltd. AEIM Pte. Ltd. is the Singapore-based international headquarters and operating company of the Polymatech group. Its activities include advanced electronics manufacturing, semiconductor packaging, memory-module assembly, medical products and other application-specific integrated circuits (ASICs). The Polymatech group's investment in Brandner Electronics OÜ has been made through AEIM Pte. Ltd. MEDIA CONTACT Brandner Electronics OÜ Tööstuse 17, 72720 Paide, Estonia Tel: +372 38 46320 Email: [email protected] Brandner Electronics OÜ's PCB manufacturing facility in Paide, Estonia. ENDS Brandner Electronics OÜ | Tööstuse 17, 72720 Paide, Estonia | www.brandner.ee Page 3 Saatja: "Nandamrao" <[email protected]> Saaja: "info - MKM" <[email protected]> Teema: [DKIM katki] For H.E. Minister Liina Vahtras – Request for meeting on Brandner Electronics’ investment and expansion in Estonia Kuupäev: 2026-10-01 11:28 Tähelepanu! Tegemist on välisvõrgust saabunud kirjaga. Tundmatu saatja korral palume linke ja faile mitte avada. HOIATUS! See e-kiri võib olla liba-, õngitsus- või pahaloomuline, kuna on saadetud asutusest, kus meiliserver on vigaselt seadistatud. Rohkem infot: KKK | teenusveeb <https://teenused.rit.ee/et/kkk> -> E-post ja kalender. For the kind attention of: H.E. Ms Liina Vahtras Minister of Economy and Industry Republic of Estonia Your Excellency, I respectfully request an opportunity to meet Your Excellency and present the current operations, investment and phased development plans of Brandner Electronics OÜ in Paide. Brandner is part of the Polymatech Group’s international advanced-electronics manufacturing network. Through our Singapore-based international headquarters and operating company, AEIM Pte Ltd, we have made a substantial long-term investment in Brandner and its manufacturing operations in Estonia. Brandner presently manufactures standard, multilayer, high-density interconnect and aluminium printed circuit boards. The company has commenced PCB production for Polymatech’s vein finders and is developing PCBs for NANORAA smartphones and other advanced-electronics products. The year 2027 will be crucial for Brandner’s next phase of development. Our programme includes: - further expansion of PCB manufacturing capabilities; - SMT lines for module assembly; - advanced capabilities for mobile-phone PCBs; - silicon carbide semiconductor packaging and power modules for electric-vehicle applications; and - continued development of skilled employment, exports and industrial technology in Estonia. Our objective is to establish the Paide facility as a significant European advanced-electronics manufacturing base, combining Estonia’s engineering strengths with the Polymatech Group’s international product platforms and access to global markets. I would be honoured to present to Your Excellency: - the investment already made and manufacturing capabilities established in Paide; - Brandner’s contribution to employment, exports and preservation of European manufacturing capability; - our 2027 expansion and technology-development programme; and - possible cooperation with the Ministry, Enterprise Estonia and other relevant institutions in support of Brandner’s continued growth in Estonia. H.E. Mr Ashish Kumar Sinha, Ambassador of India to Estonia, recently visited our Paide facility and reviewed our present operations and development plans. The Embassy-approved press release concerning the visit is attached for Your Excellency’s reference. I shall be pleased to meet Your Excellency at any date and time convenient to you. With highest regards, Dr Eswara Rao Nandam Group Chairman, Polymatech Managing Director, AEIM Pte Ltd, Singapore President, Brandner Electronics OÜ Tööstuse 17 72720 Paide, Estonia Email: [email protected]
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