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Majandus- ja Kommunikatsiooniministeerium · 7. juuli 2026
Viit
6-4/2381-1
Registreeritud
7. juuli 2026
Dokumendi liik
Sissetulev kiri
Adressaat
Taipei Mission in the Republic of Latvia
Saabumis/saatmisviis
tavapost
Funktsioon
6 Rahvusvahelise koostöö korraldamine
Sari
6-4 Tervitus- ja tutvustuskirjad, kutsed üritustel osalemiseks
Toimik
6-4/2026
Vastutaja
Mikk Vahtrus (Majandus- ja Kommunikatsiooniministeerium, Kantsleri valdkond, Majanduse ja innovatsiooni valdkond, Innovatsiooni ja tehnoloogia osakond)
Lahendamise tähtaeg
6. august 2026

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  • 📎260707_10_20_54_originaal.pdf284 KB

Sisu (failidest)

TAIPEI MISSION IN THE REPUBLIC OF LATVIA 14-2 Ausekia Street Phone: (371) 67321166 Riga LV-1010 Fax: (371) 67830135 Latvia E-mail: [email protected] TMIL/RG-007 1 June 25, 2026 Honorable Erkki Keido Minister Ministry of Economy and Industry Republic of Estoiiia Dear Hon. Minister, It is my pleasure to inform you that the “Workshop on Semiconductor Supply Chain Development,” organized by the Taiwan International Cooperation and Developrnent Fund (TaiwanICDF), is scheduled to be held from September 1 to 10, 2026. On behalf of the Taipei Mission in the Republic of Latvia, 1 cordially invite your esteerned Ministry to norninate a senior official to participate in this exclusive program. The objectives of the workshop are as follows: (1) to gain a cornprehensive understanding of Taiwan’s semiconductor industry development path; (2) to learn how Taiwan has built a comprehensive and resilient semiconductor supply chain; and (3) to share Taiwan’s experience in cultivating advanced technical talent. In addition, the workshop features exclusive field visits, and the participants have opportunity to visit prernier IC design cornpanies, wafer fabrication facilities, packaging and testing plants, and advanced training centers, as well as engage directly with leading industry professi onal s. For qualified and selected participants, TaiwanICDF will cover the costs of econorny class round-trip airfare, course fees, meals and accommodation. Participants wiII be responsible for their own personal or incidental expenses. Enclosed please find an introduction to the workshop for your reference. To secure a seat, nominated application must be submitted through this Mission no later than July 30, 2026. Should you have aiiy questions, please feel free to have your colleagues contact Mr. Eugene Wu at +371 2800 9952 or via ernail at hxwumofa.gov.tw. Alternatively, they rnay coiitact this Mission at +371 6732 0610 or via email at 1vamofa.gov.tw. 1 avail rnyself of this opportunity to renew to you, Hon. Minister, the assurances of my highest consideration. Sincerely yours Winston Wen-yi Chen Representative Encl: als Cc.: 1 Mr. Mati Murd, Director, Asia and the Pacific Region, Ministry of Foreign Affairs, Republic ofEstonia 2 Mr. Mait Palts, Director General, Estonian Chamber of Cornmerce and Industry (ECCI), Republic of Estonia 3 Ms. Jana Si1akova, Head of Internationalization, Estonian Association of Information Technology and Telecommunications, Republic of Estonia Workshop on 8 Semiconductor Supply Chain Development Date 1- 10 September, 2026 Application Deadiine 3 August, 2026 *Invitation required: Through the R.O.C. (Taiwan) embassies, representative offices or Taiwan technicat missions. Ove rvi ew Taiwan hosts the wortd’s most comptete semiconductor c[uster, with wafer foundry output ranking first gLobaL[y. As a key driver of innovation, the industry is capita[- and techno(ogy-intensive, demanding advanced equipment and [ong-term investment. n Line with the DipLomatic ALlies Prosperity Project, this workshop shares Taiwan’s experience in buitding a resiLient semiconductor ecosystem through effective po[icies and industry-academia co[Laboration. Objectives O Understand Taiwan’s semiconductor development path. O Learn how Taiwan buiLt a comp[ete and resitient supply chain. O Share Taiwan’s experience in cuLtivating advanced technica[ tatent. Content O Semiconductor DeveLopment and Trends: Overvew of wafer fabrication, packaging/testing, and emerging fields such as Al and automotive chips, highLighting key technoLogies and market trends. O Government and Academia Roles: How poLicies, R&D programs, and science parks promote innovation and talent cuLtivation through industry-academia collaboration Supply Chain Resilience Efforts to enhance key materiat supply, advanced processes, and green energy use through poLicy and innovation. O IndustriaL Layout: Functions of major science parks—Hsinchu, CentraL, and Southern Taiwan—in buitding a resiLient cluster ecosystem. O Field Visits: Visits to IC design, wafer fabs, packaging/testing pLants, and training centers with industry exchanges. Who May Apply O Background: Otficia[s from economic and industria[ ministries, and representatives from etectrica[, e[ectronics, and semiconductor re[ated associations and enterprises. O Expertise: Industrial deveLopment, techno(ogcaL innovation, and suppty chain management. /rjZ iTT) mi Tel: 886-2-28886090 E-maiI: Ly.hsu©icdf.org.tw
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